IBGA13 Max Mid-Level Motherboard Reballing Platform For iPhone 13 Pro Max

IBGA13 Max Mid-Level Motherboard Reballing Platform For iPhone 13 Pro MaxMECHANIC IBGA 13 MAX 14 in 1 Middle Frame Reballing Platform Motherboard Fixture with Stencil For iPhone X XS XS Max 11 11 Pro 11 Pro max 12 12 mini 12 Pro 12 Pro max 13 13 mini 13 Pro 13 Pro Max. MECHANIC iBGA13 MAX Middle Layer Positioning Tin Planting Platform Stencil Suit Support for iPhone X 13 Pro Max Mini Series. Features: 1. Double sided positioning single module realizes the middle layer tin planting of X 13 system. 2. Strong magnetic

MECHANIC IBGA 13 MAX 14 in 1 Middle Frame Reballing Platform Motherboard Fixture with Stencil For iPhone X/XS/XS Max/11/11 Pro/11 Pro max/ 12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max. MECHANIC iBGA13 MAX Middle Layer Positioning Tin Planting Platform Stencil Suit Support for iPhone X-13 Pro Max Mini Series.

Features:
1. Double-sided positioning - single module realizes the middle-layer tin planting of X-13 system.
2. Strong magnetic adsorption - no displacement during the tin planting process.
3. Special grade steel mesh-mesh precision tin planting Wulian tin.
4. High temperature base - high temperature operation does not change shape, quality assurance!

Usage Steps:
Take out the Mechanic IBGA 13 max tin planter and place the bottom platePlace gaskets as needed (when planting tin in the RF middle frame of the XS Max motherboard, you need to place functional functional gaskets and then place the RF dedicated tin planting net)Place the main board and locate it through the positioning column and limit areaPlace the tin-planting net magnet according to the model to automatically adsorb the positioning hole and align the tin-planting station positioning postPlace tin spacers according to requirementsUse a tin scraper to evenly fill the mesh with tin paste.

How to install:
Install the iPhone X-13/13 Pro main board on the platformCover the iPhone X-13/13Pro BGA reballing stencil on mainboardEvenly spread tin on the cover of the reballing stencilRemove the reballing stencil coverTake out the motherboard and cooperate with the hot air gun to solidify the tin point.