SKU: 1441471865

i2C T18 PCB Desoldering Pre-heating Station For iPhone X-15 Pro Max

Sale price$26.95 Regular price$29.95
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Ships within 48 hours · Estimated delivery Jul 11 - Jul 16

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Description

i2C T18 PCB Desoldering Pre-heating Station For iPhone X-15 Pro Maxi2C T18 Phone motherboard layered desoldering pre heating station with HD screen display For iPhone X 15 Pro Max repair. i2C T18 PCB desoldering station supports X 15PM motherboard separation Chip CPU glue removal degumming lamination delamination desoldering and soldering repair. Package Option: Package A: i2C T18 host + Universal module. Package B: i2C T18 host + Glue removal module. Package C: i2C T18 host + X 15 series (4pcs modules). Package D:

i2C T18 Phone motherboard layered desoldering pre-heating station with HD screen display For iPhone X-15 Pro Max repair. i2C T18 PCB desoldering station supports X-15PM motherboard separation/Chip CPU glue removal degumming/lamination/delamination/desoldering and soldering repair.

Package Option: 
Package A: i2C T18 host + Universal module.
Package B: i2C T18 host + Glue removal module.
Package C: i2C T18 host + X-15 series (4pcs modules).
Package D: i2C T18 host + Universal module + Glue removal module + X-15 series (6pcs modules).

Features:
1. T18 PCB motherboard desoldering station, magnetic modular design, constant temperature desoldering, and explosion-tin proof.
2. LCD HD screen display, 2Gears of temp adjustment, Supports iPhone X to 15Pro Max motherboard separation, chip CPU glue removal, and other functions.
3. Aviation aluminum material, CNC precision processing, high-temperature resistance, and oxidation resistance.
4. Rapid heating, matched with PTC ceramic heating pieces, it can heat up to 180°C in 60 seconds rapidly.
5. Module strong magnetic automatic adsorption, module replacement as you wish, simple and more convenient.
6. Put the chip on and switch to 245℃, then use a brush to remove the glue and tin residue on the chip, it can be adapted to 98%of the chips and can meet the needs of 98%of IC glue removal and desoldering on the market.
7. Only one host can support multiple modules, support Apple and Android double-layer motherboard layering, fit, and repair, and can also be applied to the repair of various precision electronic and digital products.

Specification:
Brand: i2C.
Model: T18.
Name: T18 PCB motherboard desoldering station.
Supply voltage: AC 110V~220V.
Minimum temperature: 180°C.
Display: LED digital display.
Maximum temperature: 245℃.
Body size: 134*116*17mm.
Scope of use: Motherboard separation and bonding.
Packing size: 214*143*80mm.

Shipping Notes
  • Free Standard Shipping on $100+ Orders to the USA.
  • Except Preorder products are shipped in 48 hours.
  • Delivery to the USA:
  1. Standard Shipping : 3-10 business days
  • If time is of the essence, please consider selecting expedited delivery for faster service.
Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy
SKU: 1441471865

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ray odell,
Bozeman, US
★★★★★ 5
I wish Izod still had this product in the darker olive from their line that i love.
Size: 32W x 32L, Color: Griffen
Size and fit.
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Reviewed in the United States on April 27, 2026
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Marie
Natrona Heights, US
★★★★★ 5
IT LOOKS AS SHOWN
Size: 36W x 30L, Color: Navy
comfortable and look good
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Reviewed in the United States on May 29, 2026
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Weiner
Battle Creek, US
★★★★★ 3
Fit is large
Size: 38W x 30L, Color: Navy
Size is larger than actual. Not the same as the Kohl's version
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Reviewed in the United States on May 12, 2026
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Kindle Customer
Draper, US
★★★★★ 5
Great pants
Size: 34W x 30L, Color: Khaki
Great and comfortable
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Reviewed in the United States on May 2, 2026
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Verified Purchase
ray odell,
Pawtucket, US
★★★★★ 5
I wish Izod still had this product in the darker olive from their line that i love.
Size: 32W x 32L, Color: Griffen
Size and fit.
WAS THIS REVIEW HELPFUL?YesReportShare
Reviewed in the United States on April 27, 2026

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